AR200 is built for thin-board transfer areas where vibration, slip, and surface scratches can quickly affect yield. Its rubber/PU outer layer grips PCB, FPC, and LCD panels gently while cushioning impact in high-speed wet-process movement.
Core Advantages: Dual-layer structure, soft surface protection, vibration damping, anti-slip grip, and noise reduction.
Selection Recommendations: Choose the suitable Shore hardness, outer diameter, width profile, and rubber/PU material based on board stiffness, conveyor speed, and process chemistry.
Applications: Developing lines, etching modules, strip lines, conveyor chains, flipper stations, vertical storage conveyors, and automated positioning systems.
Stable Operation Guarantee: Helps reduce micro-slippage, board oscillation, surface scratches, impact stress, and downtime from manual board resets.
Eliminate Conveyance Vibration and PCB Slippage in One Step. High-speed PCB manufacturing lines often struggle with thin-board vibration and micro-slippage, leading to misregistration or physical damage to delicate substrates. The AR200 Coated Wheel Disc is engineered to provide a high-friction, resilient interface that firmly grips boards without scratching. By replacing rigid pulleys with this impact-absorbing solution, equipment manufacturers can effectively dampen harmonic resonance, reduce noise pollution in the plant, and ensure that every board travels through the process flow with repeatable, precise positioning. It is the essential upgrade for stable transport in demanding wet-process environments.
High-Performance Material Engineering
· Dual-Layer Construction: The high-strength plastic core provides rigid structural support, while the precision-bonded rubber or PU outer layer offers the necessary elasticity for grip.
· Vibration Damping: The rubber interface acts as a shock absorber, significantly reducing mechanical noise and minimizing the transmission of vibration to the PCB surface.
· Surface Protection: The soft outer layer prevents the formation of micro-scratches on copper traces or substrate surfaces during the high-speed transfer process.
Tailored Specifications for Your Conveyor Layout
· Variable Hardness Options: Customize the Shore A hardness of the rubber coating to match the specific weight and stiffness of your production boards.
· Material Selection: Choose between standard wear-resistant rubber or chemical-resistant PU for specific corrosive wet-process sections.
· Dimensional Precision: Adapt the outer diameter and width profile to integrate seamlessly with existing sprocket or chain conveyor systems.
The AR200 is indispensable across PCB, FPC, and LCD manufacturing lines where precise transport is required. It is widely used in horizontal wet-process equipment including developing, etching, and strip lines to prevent boards from oscillating within the spray chamber. In LCD manufacturing, the soft coating protects sensitive glass substrates from mechanical impact during alignment and transfer. Furthermore, these discs are frequently integrated into automated board flippers and vertical storage conveyors to ensure smooth transitions between modules without causing surface defects, helping maintain consistent production rates across the entire facility.
In horizontal etching and developing modules, conveyance consistency is paramount for uniform spray application. The AR200 provides the necessary traction to keep boards centered, preventing skewed movement that could lead to uneven etch rates or damaged edge contacts. By reducing mechanical vibration, it stabilizes the transport rhythm, ensuring that high-speed equipment operates within tight tolerances without the risk of physical board interference, which directly optimizes the total cost of ownership by reducing maintenance on conveyor bearings and guide tracks.
For automated board handling and flipper stations, the disc serves as a protective cushioning interface. When boards are picked and placed or flipped, the elastic outer layer absorbs the instantaneous impact force, preventing micro-fractures in ceramic or thin FPC substrates. This reduction in impact stress drastically increases the yield rate for high-density interconnect (HDI) boards. By curbing slippage at high speeds, you eliminate the downtime associated with manual board resets and ensure that your automated line achieves its full design throughput.
| Parameter | Industrial Specification |
| Model Number | AR200 |
| Core Material | High-Strength Engineered Plastic |
| Outer Layer | Wear-resistant Rubber or PU |
| Size | 30*Φ10 × 20L × 6W |
| Function | Shock absorption, anti-slip, noise reduction |
| Point of Use | Conveyor chains, flippers, positioning mechanisms |
To provide high-precision, high-performance PCB equipment accessories, empowering the global electronics manufacturing industry to achieve efficient production.
